Features & 9679;Adopted infrared welding technology independently developed. & 9679;Special infrared heating, strong penetrating power, uniform heating of the device, breaking through the traditional hot air desoldering machine to cover the component heating, the thermal shock is more disadvantageous. & 9679;There is no need to remove the welding fixture. This machine can remove all components of 15x15-35x35mm.     Technical Parameters Model:T-862++ Heating method: infrared heating Machine power: 800W Preheating temperature range: 60-200 ° C Lamp body heating temperature range: 100-350 ° C Electric soldering iron temperature range: 200-450 ° C Preheating area: 120*120mm Table size:350*270mm Detachable chip size: 15*15-35*35mm Rated voltage and frequency: AC220-230V/AC110V 60/50Hz Features 1. Infrared welding technology which was developed independenty. 2. Infrared heating is easy to pierce and distribute evenly, can avoid the IC damage due to the fast or uninterrupted heating up. 3. Easy operate; user can operate skillfully after one-day traning. 4. No need welding tools, it can weld any chips under 25mm( T-862)/35mm (T-862++) With hot melt system, preheating range 120X80mm (T-862)/120X120mm(T-862++) 5. It doesn't impact the smart parts without hot air, and suits to weld all kinds of chips, especially Micro BGA components.