Features: This premium copper CPU heatsink ensures superior thermal conductivity and durability, effectively dissipating heat to enhances phone stability and performances . Featuring an exceptionals thermal conductivity rate of 6.0W, this thermal pad rapidly transfers heat away from the CPU, significantly lowering device temperatures and offering three size option for a perfectly fit across various phone models. Ideal for mobile enthusiasts, including gamers and professional, who require reliability cooling solution to prevent overheating during intensive tasks and extend device lifespans. Perfect for high load scenarios like gaming, multitasking, or extended work , where consistent CPU cooling is essential to maintain optimal device efficiency and prevent performances drops. Easy to install without tools, this mobile cooling solution helps reduce thermal stress by up to 30degrees, ensuring your phone remain cool and functional in demanding environments. Specifications: Component: copper Color: rose gold Thermal Conductivity rate: 6.0W Size: Approx.0.1x12.4x14mm/0.004x0.49x0.55inch, 0.3x12.4x14mm/0.01x0.49x0.55inch, 0.5x12.4x14mm/0.02x0.49x0.55inch; Option Thickness:0.1mm,0.2mm,0.3mm Package Includes: 1Box/100pcs Thermal Pad note: Please allow 1-3cm errors due to manual measurement. Due to the differences between different monitors, the picture may not reflect the actual item color.